Electronics Forum | Thu Jun 22 12:25:07 EDT 2000 | Boca
Jason, What Chrys said! Don't try to run the bottom cooler, tried it in the mid 80's, don't work and don't want it to work. If one side of a fab is maintained cooler than liquidus and the other side into reflow it would have an easy 40C temp diffe
Electronics Forum | Mon May 18 13:30:15 EDT 1998 | Earl Moon
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef
WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall
Electronics Forum | Thu Apr 16 13:50:49 EDT 1998 | Lou
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Thu Apr 16 13:47:36 EDT 1998 | Lou
| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X
Electronics Forum | Fri Sep 17 15:01:05 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Wed Oct 24 11:14:44 EDT 2001 | Cemal Basaran
Dave; Thanks for responsding so fast. here are my answers. 1-WOW!!! How do people get these cool toys? I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the
Electronics Forum | Thu Dec 08 07:55:16 EST 2005 | davef
Your understanding of the situation is correct. In both cases, you solder to the nickel. The gold [Au] protects the nickel from oxidation. When soldering, the gold moves into solution in the solder and forms an intermetallic compound [IMC] with th
Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph
Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D
