Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron
Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme
Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef
Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
Electronics Forum | Tue Dec 13 12:47:53 EST 2005 | grantp
Hi, No because we don't have the ability to do that, and what is the problem with it? Can you describe what happens and how it's different to soldering a high temp BGA solder ball. My guess is if the solder ball does not melt, then there should be n
Electronics Forum | Thu Dec 15 12:10:07 EST 2005 | muse95
It should be the other way around. A Pb BGA ball will fully melt in a Pb free process, but a Pb free BGA ball will not fully melt in a Pb process, which means the Pb from the paste on the board will not fully diffuse through the ball. This leads to
Electronics Forum | Tue Jan 10 11:51:16 EST 2006 | jax
I don't believe I have ever seen a non-destructive test for "Black Pad" that I could take back to a Fab house and collect monetary losses with... But if this test method actually does hold merit then collect away. I would like to know how this metho
Electronics Forum | Thu Mar 08 22:35:13 EST 2007 | davef
Suggestions are: * Procure solderable finishes that have sufficient thickness to avoid intermetallic problems and use storage conditions that do not promote oxide growth problems. * Bagging/sealing boards has been shown to extend storage durations i
Electronics Forum | Tue Jun 19 19:03:31 EDT 2007 | diesel_1t
Hi folks. If the solder is on the BGA but is not soldered at all on the pads, then you can discard BGA solder issues, by the other hand; you might be experiencing wicking due to heat is being absorbed on component so the balls on BGA are hotter than
Electronics Forum | Thu Mar 06 10:43:49 EST 2008 | samir
Folks, what is the industry consensus? Which is the more popular lead-free, flat finish these days? Here's what I know from my experience. IAg: 1. Quality of finish is dependent on supplier 2. Can NOT be reworked. It is known that reworking t
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