Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
Electronics Forum | Wed Mar 04 11:20:19 EST 2015 | jorge_quijano
Hola, I'm about to evaluate our BGA capabilities by using a dummy PCB+Components kit, I'll be evaluating solder paste, pick n place, reflow process & rework method. I have an idea of how to validate these processes. I'm planning to send different sa
Electronics Forum | Tue Dec 05 04:30:02 EST 2017 | jan_pedersen
You find good information in IPC-4554 that includes recommended total Sn thickness and recommended free Sn. It refers to how much usable Sn is needed to meet coating durability categories defined in J-STD-003. As example, if you need 6 months shelf l
Electronics Forum | Fri Apr 05 08:02:58 EDT 2019 | Matt
This feedback is greatly appreciated! I had my reservations on the connection validation features, as you said good in theory but I really wanted some practical information without having to purchase to get an extended feel on our various application
Electronics Forum | Tue Jul 14 07:23:50 EDT 2020 | researchmfg
There is a misunderstanding that people think the IMC layer grows the thicker the stronger soldering strength. The IMC layer can be grown and distributed evenly at the interface location will be good enough. Once the IMC layer grows too thick and ove
Electronics Forum | Thu Feb 10 22:41:20 EST 2000 | Dave F
Russ: Now that�s a good story. Nuff said on the Vegas trip, that explains everything. Especially when you say "it must have something to do with ..." I love WS609. It�s been berry, berry good to me. Intermetalic Layer (IL). A compound formed a
Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul
We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Mon Aug 23 11:27:00 EDT 1999 | Dave F
0.6 �m (25 micro inches) and self-limit around 5 mils depending on the material being plated and the process. Similarly with white tin, laminates with cleaned copper are immersed in a series of tin baths without an external source of electric curren
