Electronics Forum | Mon Feb 19 18:57:49 EST 2001 | davef
Expanding on the limit of the portion of gold acceptable in a solder connection [mentioned in an earlier post]: The embrittlement culprit, AuSn4, is 29 weight percent gold. So even if one had 100% tin as the solder alloy and 10% gold were dissolved
Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre
use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder
Electronics Forum | Tue Apr 17 10:17:10 EDT 2001 | genny
Hi, ENIG finish is the same reason I came to this forum for the first time a few months ago. I found a bunch of useful information by searching the archives. Check it out. ENIG has some good properties like flatness, and the process control has i
Electronics Forum | Wed Apr 18 20:55:20 EDT 2001 | davef
Yins are bad, this guy's serious. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically and electrically
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Tue Nov 09 11:42:37 EST 1999 | Dave F
Jeff: Try this: ROSA. John�s spot on. I�ll add that it is a fluxless method that reduces the oxides in an aqueous solution. Another source of information is: Trench, M., Hillman, D., Lucey, G., "Environmentally Friendly Closed Loop Soldering,"
Electronics Forum | Sat Oct 09 03:26:58 EDT 1999 | Brian
| Always experiencing dross in pot with different characteristic such as color, shape, dry/wet etc. Any paper, wetsites provide the more comprehesive explanation on its characteristic | Dross is a mixture of various things. The obvious ones are met
Electronics Forum | Thu Sep 16 18:07:16 EDT 1999 | Earl Moon
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Tue Aug 31 20:51:20 EDT 1999 | Raeto Zryd
Dear fellow process engineers, Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints were
Electronics Forum | Wed Sep 01 13:48:29 EDT 1999 | Dave F
| Dear fellow process engineers, | | Some solder joints "trough hole component" have cracked. I suspect that in the market some technician tryed to straighten some components (LED) and has applied enough force to actually brake the joint. The joints
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