Electronics Forum | Wed Aug 23 16:40:30 EDT 2000 | Dr. Ning-Cheng Lee
During the second reflow, the solder remelts and resolidifies. In general, the reflow temperature is not high enough to erase the microstructure developed during the first reflow. As a result, the net effect of a second reflow typically is grain coar
Electronics Forum | Mon Oct 25 21:28:38 EDT 1999 | Dave F
3%) concentrations of gold form brittle intermetallic compounds with the tin in your solder. Electroless gold is applied with an autocatalytic process that self-limits around 5 mils thickness. You're correct electrolytic gold is used for goldfinger
Electronics Forum | Tue Jun 22 08:28:54 EDT 1999 | Jason Gregory
| | I swear I posted it! I smoked an entire cigarette waiting for the damn thing to upload! I'll try it again when I get home tonight. | | | | Sorry for the inconvenience. | | | | | | | regular or filter? | I am having the same trouble. Cannot
Electronics Forum | Thu Feb 11 14:36:42 EST 1999 | Evelyn York
Hey, has anybody experienced problems with solder balls falling off BGA's? I have not been able to identify a contaminant nor any physical problems that would cause this. On packages with 'good' adhesion I have not observed any intermetallic form
Electronics Forum | Sat Jan 30 21:04:32 EST 1999 | Sidharth
Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? partic
Electronics Forum | Tue Sep 22 06:07:02 EDT 1998 | jacqueline coia
need advice to point me in the correct direction for solution to the problem of unsoldered joints which look soldered under normal visual inspection, but when pull strength test is performed the leads are coming away from pad, no strong intermetallic
Electronics Forum | Mon May 18 13:18:25 EDT 1998 | Chrys
I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and soldera
Electronics Forum | Wed Feb 20 23:17:34 EST 2002 | surachai
I AM JUST EVALUATION LEAD FREE EVALUATION AND FOUND THE BIG PROBLEM OF SOLDER CRACK BETWEEN TERMINAL OF COMPONENT AND THE INTERMETALLIC LAYER OF LEAD FREE ALLOY BUT DON'T FIND ANY CRACK BETWEEN SOLDER AND SURFACE OF PCB , COULD YOU HELP ME VERIFY T
Electronics Forum | Fri Feb 22 15:16:24 EST 2002 | rkevin
Bet your using tin/ lead plated components with a lead free Cu/Ag/Sn alloy. It leads to intermetallic cracking. Wow didn't anyone tell you to check the archives yet, It seems to be the answer given to everyone. Why have an interactive site if you alw
Electronics Forum | Tue Aug 20 11:24:46 EDT 2002 | yngwie
Experts, Is there any reference to the best wetting time when doing manual soldering in order to get the most reliable joints i.e to avoid thick intermetallic line formations. I heard people says, the shorter the better, but how short is short...sa
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