Electronics Forum | Fri Jan 29 12:04:13 EST 2010 | davef
In response: * We know of no "videos about Pb-Cu intermetallic." Intermetallics are usually observed in microsections of solder connections. * We are unaware of "Pb-Cu intermetallic." In most soldering results in a copper-tin intermetallic. * Trainin
Electronics Forum | Thu Jan 28 20:22:24 EST 2010 | rbortoli
Hi my name is Renato and I am from Brazil, and I would like to know where I can find some videos about Pb-Cu intermetallic and rework in SMT.
Electronics Forum | Sat Apr 11 09:56:31 EDT 2009 | davef
You're correct. You should expect to see an intermetallic layer in a proper solder connection. Try leaving the component at temperature for a longer period. Growth of intermetallic compounds on Cu surfaces [Klein Wassink]: d = 10^3(exp(-5*10^3/T)t^1
Electronics Forum | Thu Nov 03 13:35:46 EST 2005 | Amol
the copper forms intermetallics with tin to get Cu3Sn and Cu6Sn5. thus intermetallics formation consumes Cu and depends upon the cooling rate, faster the cooling rate, lesser the intermetallic formation
Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
Electronics Forum | Mon May 20 22:13:45 EDT 2013 | ultimatejoker
So u mean it is to form the intermetallic compound which is (Cu,Ni)6Sn5?
Electronics Forum | Wed Nov 17 10:03:29 EST 2010 | scottp
Instead of a minimum thickness, we require no exposed copper or SnCu intermetallic. We've been having a lot of trouble lately with suppliers of SN100 HASL boards giving us pads with very irregular solder deposits with areas of exposed intermetallic.
Electronics Forum | Tue Nov 29 22:32:51 EST 2005 | davef
The dissolution rate of nickel into tin is a lot slower than that of copper [into tin]. This results in a nickel-tin (Ni3Sn4) intermetallic that is only 0.25-0.75�m thin after a normal soldering process. The Ni-Sn intermetallic compound tends to be m
Electronics Forum | Fri Sep 17 07:33:56 EDT 2010 | scottp
Based on the last few pictures in the report, the root cause is lousy HASL. In fact, you don't have HASL - you've got SnCu intermetallic. Don't mess with your reflow profile, change paste, or monkey with anything else in your process. Have the boar
Electronics Forum | Fri May 12 12:07:10 EDT 2006 | solderiron
The kester better known as KY'd Sn/Cu has more copper intermetallic growth over time, dissolves copper from the board faster so repairing and touchup can damage board. Bridges more than SN100c. Does not thermal cycle well. Has shrink cracks that can
