Electronics Forum: internal (Page 16 of 89)

Re: Buying stenciling and pick and place equipement.

Electronics Forum | Sat Dec 18 14:27:42 EST 1999 | g cronin

clarissa like in the other response if you have good technical support internally you can have good results with used equipment. We have run used chipshooters and pick and place equipment, but if we didn't have qualified personel internally to serv

Flex circuit assembly

Electronics Forum | Tue Jul 15 10:36:33 EDT 2003 | davef

Equipment, Sldr pallet * Garland Service Company (972)494-1911 fax 0972 http://www.goGSC.com * Datum Dynamics 207 Highpoint Avenue Portsmouth, RI 02871 401-683-5300 FAX 3995 http://www.datumdynamics.com * EES/Grip Technogies Weston CT 203/226

Must read: The Manufacturing Coalition

Electronics Forum | Thu Feb 12 16:25:18 EST 2004 | joe

For those of you that do not know it, our little Republic here is based on Capitalism. Corporations have a right to make a profit. Moreover, a corporation has a responsibility to internal and external stakeholders. Employees are internal and sharehol

SMT Machines

Electronics Forum | Thu Aug 05 12:28:44 EDT 2004 | jasont

Hi YuKim, Have you considered purchasing 2nd hand machines? Tekmart International Inc. can help you find a cost effective solution for your additional SMT line requirements. We have in stock and access to several of the machines you've listed; -

BGA Rework Using Laser Selective Reflow

Electronics Forum | Mon Jan 03 09:58:29 EST 2005 | Dave J

One of the difficulties with BGA rework is excessive heating of the internal package (die) temperature. We have several "SRT" hot air rework systems which work well, but with Pb-Free components the challenge becomes even greater. The question I have

Reflow profile verification ??!!!

Electronics Forum | Fri Jan 13 10:39:53 EST 2006 | samir

Good one! I remember at my old company, the auditors, both internal and external would go immediately to the refrigerator where we kept our glue and solder paste and then they would spend most of their time there, because they were afraid of all of

Backing of Cards

Electronics Forum | Wed Feb 08 03:35:58 EST 2006 | GS

100�C) the moisture changes in vapour/gas generating an internal pressure causing in the worst case damages like internal planes delamination, popcorn effects, degassing, ecc. So you can understand why before reflow it could be necessary to backe and

Internal Oven Calibration

Electronics Forum | Fri Feb 10 11:33:32 EST 2006 | fredericksr

I am putting together an internal oven calibration procedure. I am interested in how stringent your oven calibration process is. Really what I am putting out is a verification process and a calibration process for the event that verification should

lead free components in leaded process

Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel

D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.

Solder wetting to ENIG pads

Electronics Forum | Tue May 13 09:58:50 EDT 2008 | rgduval

Thanks, Dave, To the 183 TAL...I was just referencing a previous post I found in the archives. We checked the profile on the board this morning, absed on the temp info that AIM recommended, and found that we're above liquidous for nearly 2 minutes!


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