Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts
Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design
Electronics Forum | Fri Jul 13 14:56:01 EDT 2001 | stevenamacdonald
One of our board vendors recently switched their stencil design to home plate apertures. Since the change the quality and yield of their PCB's has went south, Could this process change be the cause?
Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Sat May 27 11:13:27 EDT 2000 | Steve Thomas
Subject line pretty much says it all. We're going to try some stencil design changes to reduce midship solder balls. Anyone have some comments on pros or cons for either?
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Mon Apr 16 09:13:16 EDT 2007 | pjc
Tombstone head and a graveyard mind. I would not recommend 1:1 due to solderpaste beed out opportunities. Have you tried the inverted home-plate? Here are some good links on tombstoning and how to eliminate it: http://www.aimsolder.com/technical_ar
Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc
Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.
Electronics Forum | Wed Aug 01 13:35:41 EDT 2018 | tey422
Need all your experts out there for tips & tricks to make things work. I been giving a task to help redesign a simple board; only to load two components. The challenge is to use pick-n-place machine to load the coil onto the 50up array panel. Previou
Electronics Forum | Wed Jul 13 14:56:53 EDT 2005 | jdengler
I read the Cookson/Alpha paper "Optimizing stencil design for Lead-free SMT processing". I interpreted it to mean that if you had a mid chip solder ball (MCSB) problem the "radiused inverted home plate of 20/60/20 style" had the greatest impact on r
