Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Thu Aug 05 12:20:06 EDT 1999 | John Thorup
| | | | | | | | | | | | | | | Hello, | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem
Electronics Forum | Wed Jun 30 17:52:06 EDT 1999 | JohnW
| | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on cons
Electronics Forum | Wed Jun 30 13:48:57 EDT 1999 | JohnW
| | | | | | | | | | | | snip | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as ot
Electronics Forum | Wed Jun 30 15:24:23 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable res
Electronics Forum | Thu Jul 01 16:52:31 EDT 1999 | JohnW
| | | | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a
Electronics Forum | Thu Jul 01 17:12:28 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with
Electronics Forum | Wed Jun 30 22:00:29 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, b
Electronics Forum | Fri Aug 06 06:13:37 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | | | | | | | Hello, | | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same
Electronics Forum | Sun May 02 11:53:43 EDT 1999 | Chrys Shea
| | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | My question's are really : | | how is the
