Electronics Forum | Wed Apr 03 10:57:51 EST 2002 | BTaylor
This is always the case in the automotive industry, even if you move a machine a foot it needs to have an R&R study submitted. Now you could built product on the line and put it in MRB until the study is done and then release it.
Electronics Forum | Tue Nov 02 14:34:29 EST 2004 | bpevear
I agree with DaveF's recommendation to see Foresight's website (www.residues.com). They have excellent Case Studies on display (for free). There is a good case study which references the results you can expect using a ROSE tester vs other control met
Electronics Forum | Mon Feb 21 11:37:30 EST 2005 | Sara
Hi Ayman - my company's website has some helpful faq's and case studies involving cleaning. Check out http://www.residues.com
Electronics Forum | Thu Oct 25 20:15:23 EDT 2007 | wayne_
should have provide the link for all of you to look at it.... http://techon.nikkeibp.co.jp/article/HONSHI/20070926/139719/ to look at the real case study......:)
Electronics Forum | Mon Mar 21 02:54:58 EDT 2011 | kemasta
Hi Dave I agree with the 2nd point (sloppy process management) if the failure rate is higher than 5%. But this is 0.083% case, and only happen once in the blue moon. As I study about the re-flow profile for the last whole week, current parameter se
Electronics Forum | Thu Jul 14 09:42:36 EDT 2005 | saragorcos
Our facility helps customers clean no-clean soldered boards on a regular basis, and it definitely can be done but is a little more challenging than boards built with water soluble flux - one piece of advice I would give is to use low water pressure (
Electronics Forum | Tue Feb 14 09:29:46 EST 2006 | pjc
�..... their material acts as a barrier to oxidation," is wrong Mr. N. The MS2 material "consumes" oxides therefore removing the oxides from the dross by chemical reaction and releases the pure alloy. It is not a barrier and does not mix into the sol
Electronics Forum | Tue Jul 06 00:23:11 EDT 2010 | cksam
I am doing the case study of the component chip 0201 tombstoning problem. The significant causes was the reflow profiling preheat slope or ramp up rate. I really can't differential between preheat slope and ramp up rate. Could anyone here show me the
Electronics Forum | Wed May 22 10:14:08 EDT 2019 | emeto
Matt, we did the study and YES perpendicular to the V-score is the worst case scenario. We did a cross section and confirmed component is cracked. If you don't have power over PCB design, the easiest way is to change board panelization or even order
Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
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