Electronics Forum | Sat Mar 23 23:07:02 EDT 2013 | dhanish
I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise
Electronics Forum | Wed Apr 17 08:35:17 EDT 2013 | emeto
I currently run Siemens and they have their own recommendations about placement force. Most of the passive parts will be placed using 2N. For some BGA'a we will go about 4N and for certain parts that are very easy to break you should go 1N. All parts
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Wed Nov 24 16:08:09 EST 2004 | Terrapin Station
This depends on the model. Most machines and turret style typically overstroke .2mm with a force of 250 - 300 grams of force. the reason for the over stroke is to place the component into the paste. This can be adjusted through part library manipul
Electronics Forum | Wed Apr 28 10:29:04 EDT 2004 | dougt
By "placement pressure" I assume you mean force. I don't know of placement machines that have transducers mounted on the placement spindles that actually measure force. We made a board with a force sensor mounted through a hole so that it was the sa
Electronics Forum | Wed Nov 24 06:24:52 EST 2004 | Joe
Hi, I am an Engineering student doing some research on the component/nozzle interface on SMT Pick and Place machines. Could anyone tell me the force at which the nozzle hits the component as it is picked from the feeder or the placement force on a
Electronics Forum | Wed Apr 28 21:53:35 EDT 2004 | Eric
Hi, Appreciate you could share with me more datail how this is make.....and how you downlaod or monitor the pressure force.... Thanks, Eric Chua
Electronics Forum | Thu Apr 29 10:35:31 EDT 2004 | dougt
Start with a load cell (force sensor), you will need one that can handle the force range you will be placing. Someone please correct me on this if I'm wrong but I seem to recall that placement force runs in the range of a couple hundred grams. Chec
Electronics Forum | Wed Aug 04 14:32:02 EDT 1999 | Barney Whalen
| Hi all, | | What is the typical placement head pressure for the GSM1 for placing the micro / chip Scale BGAs ? | | Thanks | Upinder | ======= | Hello Upinder, The typical placement pressure for a GSM1 with Flex head is 150-170 grams. You can p
.gif)
.gif)
