Electronics Forum | Tue Jan 23 16:49:17 EST 2007 | GMan
Would anyone know what IPC / JEDEC or other standards give tape and reel and/or other packaging instructions? What is the standard followed for component packaging? Thanks!!
Electronics Forum | Wed Aug 26 05:58:17 EDT 2009 | grahamcooper22
Hi, I have no experience of the ZIP TOP bag you refer to but my advice is to follow the guideline of IPC JEDEC 33 for sealing bags containing MSDs....it states' the MBB should be heat sealed'. I cannot imagine that a ZIP will keep the moisture out an
Electronics Forum | Fri Mar 25 14:33:26 EDT 2011 | davef
IPC-7525 Stencil Design Guidelines
Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin
Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document
Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts
What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first
Electronics Forum | Fri Aug 21 04:37:26 EDT 2009 | grahamcooper22
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance.
Electronics Forum | Tue Jun 06 09:33:11 EDT 2000 | khalid
Please refer to the following document for your information. IPC/JEDEC J-STD-003. This document can be downloaded from WWW.IPC.ORG. Feel free to contact me if you have any question. Khalid.Saeed@marconi.com Regards Khalid
Electronics Forum | Fri May 05 11:10:07 EDT 2000 | John Thorup
Hello Aerin...welcome Actually you have already found a very important web site for your research. Go to the SMTnet archives and do a search. You will find a wealth of practical information. After that, go to the IPC or the JEDEC website and downlo
Electronics Forum | Wed Jun 20 21:58:37 EDT 2001 | fmonette
Dave, if you have a level 6 then you have no other option then to bake it and reflow before it exceeds the specified floor life. For more details check out the joint IPC/JEDEC standard J-STD-033. It can be downloaded for free at http://www.jedec.org.
Electronics Forum | Wed Sep 15 17:13:53 EDT 2004 | GS
Do anyone of you know if are there any Standard (IPC, JEDEC, etc) telling how much can be the acceptable level of TIC (ugr/cm2 NaCl equivalent) allowed on surace of Connectors, Components,before to be assembled on PCB ? Many thanks Rgds GS
