Electronics Forum | Wed Feb 22 20:33:25 EST 2006 | davef
Here's your design rules: * IPC-2221 * IPC-2222 Bonus is that they include the works, not just break-away tabs
Electronics Forum | Wed Mar 03 09:05:28 EST 2004 | davef
Look to IPC-2221, 9.1.3 Thermal Relief In Conductor Planes
Electronics Forum | Thu May 09 00:08:01 EDT 2002 | techment
Could someone provide help regarding IPC's recommendation on Plated Through hole's --- lead to hole ratio. I can't find it in IPC-2221 and IPC-SM-782. Thank you very much
Electronics Forum | Wed Oct 29 20:28:59 EST 2003 | davef
The possibilities are dizzying, aren't they? In our dingy fog, if we don't understand your requirement, say so. 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IP
Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef
See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6
Electronics Forum | Wed Nov 02 20:27:08 EST 2005 | davef
Why stop at fids: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards
Electronics Forum | Wed Jul 07 17:47:00 EDT 2004 | davef
For bare board design for test, try: * IPC-2221 - Generic Standard On Printed Board Design * Section standard for the board type [eg, IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards]
Electronics Forum | Tue May 22 18:21:15 EDT 2001 | davef
Again not quite what your looking for, but close, consider IPC-2221, Generic Standard On Printed Board Design, Para. 4.4.4 for minimum requirements for edge board connectors, as a baseline.
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Sat Oct 15 15:57:11 EDT 2005 | GS
Organic Solderability Preservative, is a definition that you can find, for istance, on IPC-2221A (geneiric standard on printed board design) Tabel 4-3 (Final Finisch, etc) Regards............GS
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