Electronics Forum | Thu Feb 05 14:30:29 EST 2015 | chsravan
Can I apply IPC-610 class 3 workmanship standards to an assembly made with a IPC-600 class 2 PCB?
Electronics Forum | Fri Feb 06 18:32:59 EST 2015 | chsravan
Hi Scott,Thank you for the response. I was also thinking the same that the assembly will no longer be Class III. Thanks again.
Electronics Forum | Fri Feb 06 11:11:04 EST 2015 | mascott123
I have asked that same question to a co-chair of the J-STD-001 committee who in turn checked with personnel at IPC. The answer I received is that yes you can apply the Class 3 assembly requirements using a class 2 PWB but the resultant assembly will
Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew
We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C
Electronics Forum | Thu Jan 12 22:29:10 EST 2023 | rgduval
So, as I understand it, IPC6012 are performance criteria that your board shop should be using. I think you'd want to be using IPC600 for acceptance criteria at incoming inspection. At least, that's what I always did in my CM days. And, since you'r
Electronics Forum | Fri Apr 16 17:19:59 EDT 1999 | Dave F
| | Hi, | | I just cheesed my previous attempt at this. I looked through IPC 600 and couldn't find anything relating to dimensional stability of a board with regard to stretch. I found bow and twist but nothing on size. I have a PCB that is .030"
Electronics Forum | Tue Apr 23 15:35:45 EDT 2013 | dyoungquist
Check out IPC-A-600. Revision G (July 2004) section 3.2.3 (surface) and section 3.2.4 (internal) give min/max thicknesses for various weight copper. The min also changes depending on what class (1-3) standard you are working to.
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Mon Apr 19 10:14:12 EDT 1999 | Justin Medernach
| | | Hi, | | | I just cheesed my previous attempt at this. I looked through IPC 600 and couldn't find anything relating to dimensional stability of a board with regard to stretch. I found bow and twist but nothing on size. I have a PCB that is .0
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
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