7 ipc 6012b class 2 vs. class 3 results

Electronics Forum: ipc 6012b class 2 vs. class 3 (Page 1 of 1)

Probe Mark during ICT

Electronics Forum | Mon Jun 04 10:40:37 EDT 2012 | davef

I'm not aware of any such stipulation about witness [probe] marks for assembled boards, per se. Certainly, witness marks should not affect the intended performance of the assembly, you know, like damaging the solder connection or smudging solder mate

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef

You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol

IMMERSION GOLD VS HARD GOLD PLATTING

Electronics Forum | Thu Jan 09 15:19:41 EST 2014 | davef

For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin]

Implementing Standards and Requirements within a CM - When is too much?

Electronics Forum | Fri Jun 02 14:42:06 EDT 2023 | tommy_magyar

"If for example a customer requested assemblies but never specified their requirements, would MFGs be expected/required to follow parameters from a specific class related to the end use of said product?" Answer: The customer placed an order with you

IPC pass/fail

Electronics Forum | Wed Dec 02 16:35:21 EST 2020 | kylehunter

> Hi Kyle, As per IPC 610, for class 3, this is > not acceptable, as your minimum fillet height has > to be either one of these two, whichever is > less: - solder thickness + 25% of the termination > height - solder thickness + 0.

DPMO as a metic to qualify a CEM as World Class

Electronics Forum | Wed Jan 17 18:08:51 EST 2007 | John S.

We use a fairly simple system. IPC put out standards 7912A and 9261A to define opportunities. Basicly the "number of components" + "number of solder joints" = "number of opportunities." Some six sigma benchmarking studies indicated "Sigma Level" =

Silver Immersion Finish - Moisture bake out guideline?

Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon

Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha