Electronics Forum | Wed Jan 03 15:57:38 EST 2007 | realchunks
Is there a seperate guideline for Pin In Paste process in IPC? I have IPC610 year 2000 rev C (I know rev D is out). Or do most people use the thruough hole part of the Guideline as their criteria?
Electronics Forum | Thu Jan 04 08:19:57 EST 2007 | realchunks
Dave, I assume you mean "IPC", unless there's a new type of rubbing alcohol I could use... hmmmmmmm....... Thanks Loco, like I stated earlier, I have rev C. Well, looks like I need to buy rev D then.
Electronics Forum | Wed Nov 03 09:07:07 EST 2004 | dramos1
Hi, We would like to know on the IPC-A-610 rev. C standard for acceptable and reject criteria, do we have to satisfy all that are listed on the manual or either one will be OK? Thanks for all the assistance that will provided. Dennis1
Electronics Forum | Thu Mar 03 16:33:24 EST 2005 | pjc
Revision D has over 730 new and updated illustrations of acceptability criteria and has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with
Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1
Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.
Electronics Forum | Fri Jul 09 20:54:58 EDT 2010 | bandjwet
There is no such thing as "IPCA610 compliance". The correct way of looking at this that the boards were inspected to IPC Class I, II or III Revision XX (current Rev is "E") and met all of the criteria. From a commercial standpoint it would greatly
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F
Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c
Electronics Forum | Mon Jun 08 13:26:59 EDT 1998 | D.Hammond
I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot of
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