Electronics Forum | Thu Mar 05 09:46:12 EST 2009 | davef
Solder mask requirements: * IPC-6012 and IPC-SM-840 contain detailed specifications and information regarding solder mask requirements. * IPC-A-600 defines acceptability of printed boards [analog of A-610 for board assemblies]. Why can't you use A-6
Electronics Forum | Wed Jul 05 20:50:42 EDT 2000 | Dave F
Hey KC roll-up IPC-A-600 and smack those bums on the nose with it and say "Bad fabricator don't do that on the floor again" in a firm voice.
Electronics Forum | Thu Jul 06 09:26:21 EDT 2000 | K. Chak
Hi Dave, Thanks for the reply. Which part/page of IPC-A-600 Rev F. does it call for? ..may be I am not looking in the right spot. Thanks again. Regards Kc.
Electronics Forum | Thu Jul 06 09:26:24 EDT 2000 | K. Chak
Hi Dave, Thanks for the reply. Which part/page of IPC-A-600 Rev F. does it call for? ..may be I am not looking in the right spot. Thanks again. Regards Kc.
Electronics Forum | Tue Jul 22 03:56:24 EDT 2003 | A.G.
Are there existing acceptability dedicated criteria for ALIVH bare boards? (Equivalent to IPC-A-600) In particular, how can we assess copper foil cracking after thermal stress?
Electronics Forum | Sat Nov 18 08:42:11 EST 2006 | davef
Bow & twist: IPC-A-600. Acceptability of Printed Boards 1.5%; Goal 0.005" per inch; Practicle 0.007" per inch
Electronics Forum | Fri Jul 06 10:18:02 EDT 2007 | blnorman
According to IPC-A-600, measling can occur in epoxy-glass boards when the moisture content of the board is above 0.3wgt%. Is this the industy acceptance standard for max moisture content of a board?
Electronics Forum | Wed Aug 22 21:44:04 EDT 2007 | davef
Questions are: * Do these boards meet IPC-A-600? * What does your supplier say is the source of this color variation? * What steps is your supplier taking to make the boards more acceptable?
Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens
Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,
Electronics Forum | Tue Sep 18 07:52:29 EDT 2007 | davef
Does the change from supplier to supplier as a result of: * Board definition? * Differences in processing at fabs? 3 Specification Fir Tree General Technical Specification 3a Design/Layout: * IPC-2221 * IPC-2222 3b PCB Fab: * IPC-6011 * IPC-6012 * I
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