Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70
Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de
Electronics Forum | Mon Feb 09 16:55:28 EST 2009 | cuperpeter
Hi Sachin, thanks for your feedback. According to our supplier, surface plating is electrolytic gold over Nickel(not ENIG), but I think that is a still improper thickness for Au. (according to 3rd Working Draft from September 2008 of IPC 2221B "0.4
Electronics Forum | Fri Nov 14 03:41:26 EST 2008 | kywl
For your pad layout and spacing between > components, look here: _a class=roll > href="http://portal.ipc.org/Purchase/ProductDetail > .aspx?Product_code=77b562c1-b8f8-db11-8a6a-0050568 > 75b22" > target="_blank"_http://portal.ipc.org/Purchase/Pr
Electronics Forum | Thu Dec 07 09:07:28 EST 2000 | Mike Andrews
Have you tried contacting your locat MEP (Manufacturer's Extension Partnership)? Here in New England at least they have a good reputation and I have personally found them to be a great resource. Use the link below to get to their national site - ther
Electronics Forum | Thu Dec 07 10:12:39 EST 2000 | ralph
I don't know about Dinah mo..but I do know a good joke. And yes..I do consider myself lucky to find this site. THough I'd wish I'd found it 4 yrs ago when I entered into Electronics Manufacturing. Anyway...thanks for the help..and You too Mr. Wiza
Electronics Forum | Fri Dec 08 12:34:53 EST 2000 | rogerg
If disqualified, suggest moving to Montana, starting a ranch and becoming a dental floss tycoon....wax it up and put it in a little box to sell downtown.....got to be less stress. On the more serious side I would like to thank the Wizard and all the
Electronics Forum | Thu Nov 11 10:51:16 EST 1999 | KenF
Could anyone tell me where I can find some literature/standards describing the dimensions and solder land sizes of all common SMD components available in the market? IPC-SM-782 does provides some but not all. Thanks in advance for any response. Rega
Electronics Forum | Mon Feb 23 13:25:21 EST 1998 | Steve Gregory
Steve - you must not work to IPC class 2 or 3 requirements. If the solder is "pillowed" around the lead, I would strongly suspect a wetting problem. Most of the Paladium leads I see soldered have a strong line of demarcation but no pillowing. Hav
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