Electronics Forum: ipc and 2221 (Page 16 of 28)

Pre-bake times and temperature for polyimide boards

Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper

we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i

Conformal coating mask dots and halos

Electronics Forum | Thu Feb 25 07:37:42 EST 2010 | pcbrown

We are using Humiseal 1B31 and polyester dots for masking. We are spraying this in a Binks sprayer mixed at almost 1:1 with 521 thinner. Whe are seeing the coating creating thin halos around the poly dots as if the dots are "rejecting" the coating. T

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval

We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef

Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we

Re: IPC Standards and ISO 9000

Electronics Forum | Wed Dec 06 20:19:24 EST 2000 | Michael Parker

Ralph- Good thing you found this website so early on in your CM worklife. I am guessing you knew the job was dangerous when you took it. Be sure to refer back here daily, you will learn a mountain of things in a short time. The library also has a va

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Wed Nov 03 09:18:27 EST 2004 | Simon UK

Hi Dennis, It is all dependant on what you state for the class of product i.e. Class 3 is the top end acceptance criteria used mainly in Aerospace and Military. You have 2 terms you need to grasp to avoid confusion. 1. Acceptance Criteria 2. Target

Your opinion about RoHS and WEEE ?

Electronics Forum | Thu Dec 16 14:51:15 EST 2004 | blnorman

It's driven by those highly technically astute politicians in Europe. IPC has a lead-free forum you can subscribe to and almost to a person in the forum agrees that elimination of lead in solder is assinine. From the automotive end of electronics

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris

Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef

J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200


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