Electronics Forum: ipc and 2221 (Page 9 of 28)

Wave Cassettes and Heat convection

Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef

Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef

Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.

Fuji Pick and Place Machines

Electronics Forum | Sat Jun 05 08:18:03 EDT 2004 | vinitverma

Hi Grant, If you're really looking for speed, I'm sure you're looking for another machine for doing the QFPs, BGAs stuff etc. In that even, why not have a look at the long proven Assembleon FCM machine!! It is a totally different concept with UNMATC

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef

I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,

Wave Cassettes and Heat convection

Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514

Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610

BGA and QFP orientation in trays for pick and place

Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith

BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh

Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr

Re: Geometric Dimensioning and Tolerancing

Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon

| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor

J-STD-002 and -003 solderability testing...

Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef

Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu

Double sided design

Electronics Forum | Thu Aug 25 10:32:03 EDT 2005 | davef

IPC-2221A, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer can choose the appropriate sectional standard for a specific techn


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