Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Thu May 23 07:50:04 EDT 2013 | icin
The attached images appear to be a result of a touchup process. We believe that this is not a fracture, but more of a condition where the solder touchup process did not completely flow the solder. Is this acceptable per J-STD-001 and IPC-A-610 Class
Electronics Forum | Wed May 23 10:11:43 EDT 2012 | blnorman
Simple answer is no, there is no universally acknowledged acceptance criteria. Some time ago, I started a spreadsheet with the acceptance levels suggested by various labs on the individual ionic species. All are relatively close in their individual
Electronics Forum | Fri Dec 07 09:43:04 EST 2001 | Russ Steiner
I have a mixed technology PCB that has SMT all on bottom, TH parts on both sides (Yes, I realize that's bad. Can't be avoided.) We have designed a 10-up panel, 2 x 5 array. There are 50 leads per bd, 500 per panel. How much time is reasonable to a
Electronics Forum | Wed Sep 21 16:23:36 EDT 2005 | 14367
I was going to ask the same question. As was mentioned, it depends on the classification of product. If it's IPC Class 3, with a requirement for high reliability, I'd want the OEM manufacturer to have a defined statement on this issue for more that
Electronics Forum | Mon Jul 15 18:11:36 EDT 2019 | slthomas
First question - is your company already compliant with and/or certified to AS9001? If not, is your company compliant with and/or certified to ISO 9001:2015? There are several overlapping requirements. If the answer is no to the previous and you pla
Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef
See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6
Electronics Forum | Fri Sep 23 15:10:45 EDT 2011 | action_101
The IPC-610 class II spec is very reasonable. If they expect class 3 then make them pay for it....IMO
Electronics Forum | Tue Apr 24 21:12:32 EDT 2001 | davef
I prefer mine skewered with a remoulade, yum. IPC-A-610 allows component side overhang to the lesser of either up to 25% of the component termination width or up to 25% of the width of the pad for Class 3 devices. Help us understand your problem.
Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar
Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr
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