Electronics Forum | Wed Aug 27 13:08:30 EDT 2008 | vladig
Td - is the degradation temperature for a laminate (board), while Tg - is glass transition one. There is one more (even more important) - delta Tg. They characterize the quality of the laminate material. Regards, Vlad www.sentec.ca
Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi
Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef
There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass
Electronics Forum | Mon Feb 06 10:12:30 EST 2006 | Yash Sutariya
Hi, I authored the presentation so I may be able to help you out with your Q's. 1. IPC is in draft stage for 4 new material specs. These are in the presentation. I would focus on IPC 4101/ 121 and /124. Match your current Tg requirement to the T
Electronics Forum | Thu May 08 12:11:30 EDT 2008 | boardhouse
Hi Wayne, I am just curious what material is being called out. Are you just specing FR4 or are you calling out a particular IPC 4101 / Some recommended laminates designed for Lead free assembly are: Isola 370HR Nelco 4000-11 or 4000-29 Iteq IT15
Electronics Forum | Tue Jul 20 16:02:12 EDT 2010 | mikesewell
You may want to look at IPC 7721 Method 3.2 Bow and Twist Repair. In extreme cases you may need clamp or weight the pcb with bow in the other direction to yield a "flat" pcb in the unrestrained state. You will have to take the PCB up to or slightly
Electronics Forum | Thu Aug 17 22:22:29 EDT 2000 | C.J. Long
Hi erverybody: I am from a PCB shop. One of our product is with 19 X 19 ceramic BGA and my customer is experiencing 0.1 - 04 % failure of open trace on cornoer BGA pad. Substrate is FR4 with TG 135 degree C and delta Tg is well below 3 degree C. Tra
Electronics Forum | Thu Nov 20 13:00:36 EST 2008 | jameskelch
Calling out materials by name locks you into laminates by brand. If these are typically phenolic materials it can lead to moisture absorption, less mechanical strength and more prone to delamination during assembly. It is more effective to refer
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Mon Jun 12 10:46:38 EDT 2006 | Chunks
It's hard to believe MoonMan spends this much time typing these rants. Guess the boys at ever so much higher I.Q. standard of engineering, IPC, kicked him out there too.
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