Electronics Forum | Tue Jan 10 11:38:27 EST 2017 | charliedci
68 to 72F, 25 to 30% humidity. IPC might have exact numbers.
Electronics Forum | Wed Nov 12 21:07:47 EST 2003 | davef
Please email us.
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Mon Nov 17 14:14:15 EST 2003 | blnorman
The main function of the test is to evaluate the solder mask. Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on O
Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Electronics Forum | Mon Feb 09 06:56:39 EST 2015 | saoasasd
What is the maximum PCB shelf life for double side PCBs after first reflow? I mean, after assembly bottom side, how long can I keep the PCB without solder paste waiting for the second reflow? (Considering exposure on production environment conditions
Electronics Forum | Thu Feb 05 15:12:58 EST 2004 | pjc
There is the IPC/JEDEC J-STD-033 that addresses moisture sensitive components. Go to http://www.ipc.org for the standard. Your factory/storage area environment will dictate exposure times allowable. Be mindful of temperature and humidity changes- lik
Electronics Forum | Thu Jul 18 15:20:17 EDT 2002 | dragonslayr
I suggest following the standards developed by IPC for DPMO (go to IPC. org for more info) Create your own benchmark, within your own environment, for the specific PCA, then do trend analysis, 6 sigma improvements, etc. For a rule of thumb benchmark
Electronics Forum | Wed Apr 05 08:51:25 EDT 2000 | Wolfgang Busko
Emmanuel: Popcorn effect is mostly caused by entrapped moisture in the components package material. Plastic ICs are known for absorbing and storing moisture when exposed to normal factory conditions. They should be stored in an moisture reduced envir
IPC is the trade association for the printed wiring board and electronics assembly industries.
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