Electronics Forum: ipc gold plating spec for wire bonding (Page 1 of 1)

soft gold vs immersion gold

Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef

90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125

Re: Gold Finger Cleaning

Electronics Forum | Sat Nov 14 08:05:54 EST 1998 | Earl Moon

| | | | I believe that gold fingers on my circuit boards are being | | | | contaminated and need to clean them with some chemical | | | | solution. Any recommendations. | | | | | | | Chuck: What is the type and source of your contamination? Dave

Re: Gold Finger Cleaning

Electronics Forum | Fri Nov 13 23:33:33 EST 1998 | Kallol Chakraborty

| | | I believe that gold fingers on my circuit boards are being | | | contaminated and need to clean them with some chemical | | | solution. Any recommendations. | | | | | Chuck: What is the type and source of your contamination? Dave F | | We a

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