Electronics Forum: ipc j-std-033c (Page 1 of 1)

Baking MSDs in tubes?

Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech

Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech

Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro

baking out pcbs after reflow process

Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1

I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r

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