Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,
Electronics Forum | Fri Jan 03 12:01:46 EST 2003 | jax
Alot of the companies out there use Standards developed internally, centered around there paste, equipment, and reflow processes. Normally you will see either 5mil or 6mil stencils used for everything in house with the exceptions of specific boards.(
Electronics Forum | Mon Jul 20 02:35:42 EDT 1998 | Asher Levy
Looking for recommendation, need your on hand experience to decide on narrowing stencil opening relatively to actual pad on pcb for 0603 and 0402 components also info on stencil thickness ? (I have a very dense board with 0603 and 0402 comp.) Thx
Electronics Forum | Fri Aug 06 03:51:06 EDT 1999 | Thomas
Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. My regular stencil manufacturer recommend the following: Thickness: 8 mils 0805 opening: Oblong 0.35 X
Electronics Forum | Wed Jul 22 11:27:25 EDT 1998 | Russ Miculich
I agree with the response and strongly recommend that you use the "home plate" design to reduce solder ball entrapment, and that the under cut for the 0402's in particular be 80% of the pad size. Solder slump is typically about 1.2 to 1 so spread wi
Electronics Forum | Mon Jul 20 13:47:04 EDT 1998 | MMurphy
:On a dense board, a great way to reduce solderballing is to either; print paste 1:1 with pad size using a 5mil foil, reduce aperture openings by 10% of pad size or change aperture shape to "Home Plate" design. If none of these work on their own you
Electronics Forum | Sat Aug 07 11:10:03 EDT 1999 | JohnW
| Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. | My regular stencil manufacturer recommend the following: | Thickness: 8 mils | 0805 opening: Oblong
Electronics Forum | Mon May 27 07:16:27 EDT 2013 | mskler
We have an LED 0603 package, We are using stencil of 5 Mil, Before Reflow placement is perfact but after reflow it tis found that there is more than 30% LED are tilt. Can the speed of Fan in Reflow can help or I have to reduce the PAD opening in Sten
Electronics Forum | Fri Apr 23 14:59:14 EDT 1999 | Chrys Shea
| Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these g
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