Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Thu Feb 10 15:20:37 EST 2005 | Kathy
Hello All, Can someone direct me to businesses that will come to your place of work and certifify your operators in lead free soldering for Class 2 electronic circuit boards. Thanks in advance, Kathy
Electronics Forum | Tue Feb 15 05:10:01 EST 2005 | bandjwet
Another source for hand-on training as well a sCD-based training for l-f processes is BEST at http://www.solder.net
Electronics Forum | Thu Feb 10 20:48:23 EST 2005 | davef
Try here: * http://www.circuittechctr.com/training/0250033.shtml * http://www.solderingtech.com/training/
Electronics Forum | Mon Feb 02 22:26:09 EST 2004 | Henry
Any one who knows the international certification programme for lead-free product testing? such as IPC, IEC....... Thank you very much
Electronics Forum | Fri Sep 02 08:16:14 EDT 2005 | pjc
From Ray P. Prasad's article in this month's SMT magazine about the new IPC-7095 revison: ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some
Electronics Forum | Mon Aug 04 15:46:05 EDT 2014 | dyoungquist
What do you mean by "airborne"? We have been using SnPbAg for 15+ years to build assemblies to IPC class II standards although with most assemblies going to Pb free, we are not using it near as much as we used to.
Electronics Forum | Wed Aug 06 14:49:06 EDT 2014 | dyoungquist
Sn62Pb36Ag2 has a higher liquidus point of 189C as compared to Sn63Pb37 at 183C. You may need to slightly adjust your oven profiles to use it compared to SnPb. We have had good solder-ability and reliability with it in our IPC Class II products. A
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc
Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
.gif)
winsouce.jpg)