Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Tue Dec 17 16:27:02 EST 2002 | davef
I�m not clear on the problem. What I get: * Your fabricator did not deliver the product that you asked for in your purchase order. * Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed ci
Electronics Forum | Wed Dec 08 19:50:34 EST 2004 | shen_zte
can anyone tell me the benifit of the solder mask onto pad(part) or pad defined by solder mask?and how to excute the SMT process ? thanks.
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
Electronics Forum | Fri Dec 10 08:42:37 EST 2004 | mattkehoe
We had some bad experiences trying to work with soldermask defined BGA pads. If the opening in the soldermask is right to the edge of the copper/pad without a space it can leave reside on the pad and nothing will stick to it. See http://www.sipad.com
Electronics Forum | Tue Dec 17 11:01:24 EST 2002 | Tim Marc
Hello all, One of our PCB manufacturers coated a through hole connecters vias with solder mask. The only IPC references that comes close to describing this problem is 2.9.2 Registration to holes, and subsequent specification 6.3.1 PTH � Vertical fil
Electronics Forum | Tue Dec 17 17:47:49 EST 2002 | Tim Marc
Dave, I�m talking about the 75% vertical fill of solder IPC 6.3 criteria (B), and 6.3.1 Fig 6-5. I also referred to the annular ring of the Plated-Through-Hole, being coated with solder mask. Semantics, yes I did refer to the Plated-Through-Hole (Sup
Electronics Forum | Wed Jan 05 14:45:14 EST 2000 | Hoyt Moore
Does anybody know how to remove solder mask from pads that were masked over.
Electronics Forum | Wed Nov 20 01:38:53 EST 2019 | ajspec
Hi, i'm facing solder mask peel off but limited to the solder defined pad only(opening area). no peel off on the other area and it happened on electroless nickel immersion gold finishing only. for other finishing is not affected. kindly advise if you
Electronics Forum | Wed Jun 23 13:34:29 EDT 2004 | df_indy
I am four weeks into my new job, there always seems to be some issues here with PCB every week. Today while I was checking some assemblies with micro-scope, I found a lot of tiny bubbles/blisters on the board. They are just little dots if you look
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