Electronics Forum | Wed Aug 04 16:37:56 EDT 1999 | Doug
| Hello Netters, | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | Thanks for any help | | Tom B. | | Tom, The IPC sets the standards for acceptability. But in a nutshell if the ball i
Electronics Forum | Thu Aug 05 04:51:46 EDT 1999 | Wolfgang Busko
| | Hello Netters, | | | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | | | Thanks for any help | | | | Tom B. | | | | Tom, | The IPC sets the standards for acceptability. But in a nu
Electronics Forum | Thu Aug 05 08:39:26 EDT 1999 | Wayne Sanita
| | | Hello, If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but after c
Electronics Forum | Wed Mar 24 15:10:23 EST 2004 | davef
Without a proper picture, I'd reject the parts that you describe based on IPC-A-610, 7.2, which says words to the effect: Defect - Class 1,2,3 - Dirt and particulate matter on assembly, eg, dirt, lint, dross, metallic particles, etc. Absence or pres
Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
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