189 ipc standard acceptance criteria solder beads results

Electronics Forum: ipc standard acceptance criteria solder beads (Page 1 of 19)

CCGA solderability criteria

Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika

Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp

Leadless(passives) solder joint criteria

Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner

We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr

SMD acceptable criteria

Electronics Forum | Fri Dec 09 13:32:14 EST 2005 | jbrower

Hi Ajay, Does your company currently use any quality standards or is it made up as one goes by the QA department? You might find that using IPC 610A Acceptability of Electronic Assemblies very usefull. This manual is our base line for acceptable or

QFN standoff, industry standard

Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev

Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61

IPC/JEDEC standard for solder paste printing defects

Electronics Forum | Fri Mar 25 06:03:40 EDT 2011 | arwankhoiruddin

Thank you for the reply, Davef. I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percenta

What is the best IPC standard to refer to for Cleaning of Printed Board Assemblies? Thanks, Joe

Electronics Forum | Thu Mar 14 15:55:34 EDT 2024 | davef

Process Requirement Standard - J-STD-001 - Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable a

Re: Void in solder bump

Electronics Forum | Fri Jan 15 09:27:18 EST 1999 | Earl Moon

| I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | Thank you, | Wirat

Void in solder bump

Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul

I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15

Re: solder balling

Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis

Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal

Is solder purity affect solder joint reliability?

Electronics Forum | Mon Jul 14 09:41:35 EDT 2008 | davef

Q1. Do we really need to follow the IPC J-STD-001 Solder purity? A1. Yes, you should control impurities in solder. Further information: * "Allowable concentration of contaminating elements in solder: impurities are harmless unless their level goes to