Electronics Forum | Fri Sep 21 16:00:55 EDT 2001 | davef
In addition to providing guidelines for BGA inspection and repair, IPC-7095 also addresses reliability issues associated with BGA: 7095, �Design and Assembly Process Implementation for BGA's� Your boards should be assembled in conformance with: *
Electronics Forum | Wed Jan 23 01:24:45 EST 2008 | dragonslong
Hi ppl, i just joined my company as a quality engineer and was revising our incoming visual inspection. I was reading the IPC guidelines of IPC-7095. However, i have some problems which i hope the experts from this forum could help. IPC-7095: At on
Electronics Forum | Tue May 22 11:38:04 EDT 2012 | naynayno
I am looking for IPC or other published standards that specify cleanliness levels for: 1) solder paste stencils 2) selective solder pallets When we cleaned PCB's we used a limit of 4 M-ohms. Now that we have transitioned to No-Clean, I am wonderi
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
Electronics Forum | Tue Jul 19 10:28:21 EDT 2016 | mrk
What kind of oscillator are you placing (Manufacturer part #)? I do not believe that oscillators fall under the "chip component" category. Even if they did, most all SMT oscillators that I have come into contact with have 1 sided terminations on the
Electronics Forum | Thu May 17 22:41:05 EDT 2001 | davef
Hi Bob Still getting the cushy jobs, eh? [Tennent's and McEwans are two of my favorites. "Ahh, Beer! My one weakness...my Achilles Heel, if you will..." Homer J Simpson Quote 89/114] Under "Acceptable" for "Pin-In-Hole/Intrusive Reflow Inspection
Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan
After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin
Electronics Forum | Thu Apr 12 03:55:06 EDT 2001 | surachai
Dear anyone ; Every time that we run profile now ,we will create profile from recommendation of vendor flux and the some critical parameters such as thermal shock or others ... but I don't know that Do you ever create standard profile to be procedure
Electronics Forum | Thu Jun 24 04:38:31 EDT 1999 | Vinesh Gandhi
Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody help
Electronics Forum | Thu Dec 17 17:34:26 EST 1998 | Earl Moon
| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (w
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