Electronics Forum | Thu Nov 19 09:32:52 EST 1998 | Earl Moon
| | | | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wav
Electronics Forum | Thu Nov 19 09:55:47 EST 1998 | Dave F
| | | | | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the w
Electronics Forum | Thu Dec 09 15:19:21 EST 2004 | nrocco
Can anyone point me in the direction to find some IPC standards for lead free solder joint reliablity tests, such as shear tests, pull tests, vibe tests, enviroment tests, etc. I need to know what the specs. are on all aspects of reliability and how
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef
You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.
Electronics Forum | Wed Aug 04 16:37:56 EDT 1999 | Doug
| Hello Netters, | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | Thanks for any help | | Tom B. | | Tom, The IPC sets the standards for acceptability. But in a nutshell if the ball i
Electronics Forum | Fri Jul 08 16:35:04 EDT 2005 | Jason Fullerton
"Whether or not you need a toe fillet depends on your application. We have high reliability products where we can't use a QFN over a certain size, regardless of toe fillet. We have other applications where we meet the thermal cycle requirements for a
Electronics Forum | Thu Aug 05 04:51:46 EDT 1999 | Wolfgang Busko
| | Hello Netters, | | | | Can anyone provide me with info or where to get info on acceptability of solder beads and solder balls? | | | | Thanks for any help | | | | Tom B. | | | | Tom, | The IPC sets the standards for acceptability. But in a nu
Electronics Forum | Thu Aug 05 08:39:26 EDT 1999 | Wayne Sanita
| | | Hello, If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but after c
Electronics Forum | Sat Jul 22 04:52:31 EDT 2023 | shrikant_borkar
Here below clarification may help you I suggest you to refer IPC-AJ-820A Assembly and Joining Handbook for the entire information of applicable standards. IPC-J-STD (IPC-Joint Standard): IPC-J-STD is not a standalone standard; it refers to the serie
IPC is the trade association for the printed wiring board and electronics assembly industries.
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