Electronics Forum | Thu Mar 03 16:33:24 EST 2005 | pjc
Revision D has over 730 new and updated illustrations of acceptability criteria and has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with
Electronics Forum | Fri Jul 12 03:05:30 EDT 2002 | Dreamsniper
Is there a standard with regards to the height of a PBGA ball diameter that will say that it has undergone a double drop ? What is the criteria of identifying that a PBGA solder ball has done a double drop and that it is acceptable or not acceptable.
Electronics Forum | Tue Mar 19 17:08:12 EDT 2019 | asksmt
Hello Experts, is it acceptable in IPC standard to have two drill hole on a single pad overlapped? soldering and reliability wise ? intent is to solder two parts in parallel together. Thanks for your comments.
Electronics Forum | Wed Mar 24 10:28:51 EDT 2010 | Sean
Hi all, Anyone used to come across solder void underneath mosfet as shown in the attached file? Will this pose any reliability issue, such as get burnt during functional test? How to over come this problem? As far as I know there is no acceptabl
Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis
The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ
Electronics Forum | Fri Mar 01 08:35:27 EST 2002 | caldon
I am on board with Dave F.(like I usually am). I can not imagine what IPC specs the auditor is speaking about. The Stencil Design criteria, 610, and 001 do not fit the type of solder deposition you speak of (nor I think they should). The machine para
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
Electronics Forum | Wed Jul 12 08:57:58 EDT 2006 | Evamaria
Mike , Look at http://www.circuittechctr.com, Guidebook, section 6,6.1. This method of attaching jumper wires is in accordance to the acceptability criteria of IPC-A-610 section 11.2.4.3. You did not specify what wire AWG is. I am assuming it is sma
Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon
| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp
Electronics Forum | Tue Dec 14 18:03:22 EST 2004 | Dreamsniper
Hi, Can you guide with the above? I read ROSE Test is a process control tool. What about Ion Chromatography, SIR and FT-IR. What Accpetance Criteria will I use for our assembly when using WS Flux? My WS Flus says it has 0% Halide so What can Ion Chr
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