Electronics Forum: ipc standard acceptance criteria solder beads (Page 9 of 19)

Solder Ball Criteria

Electronics Forum | Tue Mar 17 07:32:10 EDT 2009 | davef

Solder ball acceptance: IPC-A-610, 6.5.3.1 & 12.4.10. Solder balls: 5 ball system: * No more than 5 balls per square inch (100mm2) allowed * Solder balls can not be greater than 5 mil (0.005in) (100um) * Solder balls cannot be less than 5 mil (100um)

Solder balls

Electronics Forum | Mon Nov 18 04:04:43 EST 2019 | ramesh_10377

hi initially, as per PCB design and gerber file of PCB we got 5 mil stencil, during process observed lot of solder balls (70-80%), then we decided to go for 4 mil stencil with c-cut. now the problem is reduced and still solderball exists which is a

Intrusive Reflow

Electronics Forum | Wed Nov 27 01:10:05 EST 2002 | iman

Hi and thanks for the replies. does anyone have soldering acceptance specifications, for intrusive reflow soldering? any reference (eg. IPC) Standards to follow?

Non wetting spots of flex PCB pads

Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001

I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te

Process Tin lead vs lead free components

Electronics Forum | Mon Sep 12 10:41:50 EDT 2011 | processmxli

Hi All We have run SMT process with SnPb but we’re installing some lead free components like capacitors and resistor lead free. After the reflow oven all components have good appearance with solder join sheen. But the lead free components the solde

Soldering Specification Needed

Electronics Forum | Fri Sep 23 12:24:57 EDT 2011 | minda

I found some useful information in a red line version of IPC-A-610E I uncovered with a quick google search, and I will see what I can find out about their standard of acceptability.

Lead free Solder Paste troubles !!!!

Electronics Forum | Thu Sep 23 14:58:50 EDT 2004 | C Lampron

EMS-Engineer, Lead free alloys have a very low wetting creep. You probably will not ever get the same type of weting with a LF as opposed to SN 63/37. The question is if it is acceptable. Lead free solder joints cannot be inspected to the same crite

Who should operate an AOI? operator or Inspector?

Electronics Forum | Thu Nov 17 13:04:58 EST 2005 | tommyttr

AOI should be operated by an INSPECTOR! Inspectors do not operate assembly machines or automated assembly equipment, why would an operator run an Automated Inspection? Are your operators certified to IPC standards to make calls on bad solder joints o

Fillet Tearing

Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph

Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D

Confused....Need Help On AS9100

Electronics Forum | Thu Aug 07 14:08:30 EDT 2008 | arminski

Can A Company or Electronic Manufacturing Company go for AS9100 certification if the Quality Policy states that we only meet IPC Class 2 Standard? I'm just very confused for I know AS9100 is an Aerospace Quality System and must meet IPC Class 3. thi


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