Electronics Forum | Fri Nov 30 12:21:26 EST 2018 | davef
Three things ... 1. Since you are soldering a component over a hole that limits the possibility that the hole could be filled with solder, it makes me wonder if the hole is supposed to be filled with solder. What do the engineering notes say? 2. Ta
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
Electronics Forum | Thu Oct 11 14:56:27 EDT 2007 | chef
Thank you- my point exactly and it starts in SMT- operators pulling the wrong paste from the fridge, touch up using the wrong solder wire, etc. My solution- GET THE LEAD OUT!!!!! I'm a CM- high mix, low to medium volumes. No steady all day every day
Electronics Forum | Fri Jan 05 12:17:31 EST 2007 | Cmiller
Our first pass yield across all our products is above 95% but we include anything that does not meet IPC standards. Probably 75% of our failures are not electrical. AOI is a great tool to get a consistent measure of your process. I dont know how anyo
Electronics Forum | Fri Mar 23 09:28:46 EST 2001 | PeteC
Well, it's hard to say what it started out as, a smear, splash or ball cause the solder formation on the finger after reflow is spread out ya know. I looked at an archive for possible causes and one was printer operators with paste on their fingers.
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Sat Oct 10 04:58:18 EDT 1998 | Tony B
| *Reply to: ericr@nj.tanon.com | | Without going into a lengthy explaination {at this time}, has anyone experimented, tested, evaluate, and/or 'perfected' an SMT double-side reflow process. Presently I'm using a Kester R593 OA (water soluble) Sn63/
Electronics Forum | Wed Feb 10 12:52:21 EST 1999 | Dick Casagrande
|I'm getting in a little late on this but my 2 cents is: We have been using no-clean flux for a few years now but up till last month were still cleaning (the white residue) our boards (all thru hole). Finally did some investigation and found the flux
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