Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef
IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components
Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef
Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
Electronics Forum | Thu Nov 28 13:13:02 EST 2024 | carl_p
Hello, If you look up IPC 1601, you should find it detailed in there I believe. I could be wrong though as thats off the top of my head. You can also talk to your board supplier as they will offer some advice also.
Electronics Forum | Fri Aug 10 13:46:30 EDT 2012 | lrota
I would check the IPC spec IPC-1601 ( Printed Board Handling And Storage Guideline). Also, be sure your dessicant does NOT contain sulphur in either the dessicant material or the paper holding the material. Enthone advises to not use dessicants ins
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Tue Jan 13 15:48:58 EST 2015 | natashakt
170 degrees Celsius) and regular FR4 materials. I am trying to see if we can use table 5 on page 14, "Recommended Equivalent Total Floor Life (Days)" to find out how long (at specific humidity and temperature) our populated and unpopulated PCB's can
Electronics Forum | Sat Apr 27 15:42:53 EDT 2019 | davef
Your ppl are correct, the capacitor is not sealed. So, it is perfectly acceptable for the capacitor to have absorbed moisture. If your ppl don't either prevent moisture absorption or remove the moisture prior to soldering, their component could fail
Electronics Forum | Fri Nov 11 20:29:45 EST 2022 | emeto
SMTA-643865, this is great information. I recently found online IPC1601 table saying 12months + . I was wondering what the + means? My company wants to scrap ENIG boards for 20k just because they hit the 1 year mark. Boards are perfectly sealed, so I
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
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