Electronics Forum: ipc-610 and class and iii (Page 1 of 3)

BGA assembly and inspection

Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes

60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept

N2 and Voiding??

Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp

Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan

IPC Class II and Class III reliability

Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef

MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but

Info/Papers correlating lead protrusion and reliability

Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT

I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT

IPC Class II and Class III reliability

Electronics Forum | Tue Apr 08 12:38:12 EDT 2003 | Denise

I'm looking for comparison data on MTBF for solder joints meeting IPC Class II vs Class III.

IPC Class II and Class III reliability

Electronics Forum | Wed Apr 09 12:18:37 EDT 2003 | MA/NY DDave

Hi This is an excellent question or research project. I would call the IPC and find out if anyone has already done this work. My guess is that Class III should be slightly better, yet considering the application difference where Class III is used

IPC Class II and Class III reliability

Electronics Forum | Wed Apr 09 09:36:18 EDT 2003 | iman

what r your test running parameters? what end-application?

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 13:34:07 EDT 1999 | Scott McKee

| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 14:17:55 EDT 1999 | Steve Schrader

| | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performin

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 13:49:29 EDT 1999 | Bob Neverosky

| | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performin

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