Electronics Forum | Fri Aug 28 05:26:05 EDT 2009 | sachu_70
Hi Dave, Would this be different from IPC-610-D. I am not sure.
Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT
I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT
Electronics Forum | Wed Mar 08 18:09:52 EST 2006 | jax
Part is most likely a QFN package. IPC-610-D has standards on solder quality for this new type of package.
Electronics Forum | Thu May 20 21:16:46 EDT 2010 | erli
Hi Pat According IPC-610D voids biger 25% are considered defects. You need verify you Pre Heat and try to reduce the ramp. Its very importante verify if the BGA`s are avoid hummity. Erli
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
Electronics Forum | Mon Feb 20 04:59:40 EST 2006 | Loco
For visual inspection table 1-2 seems to be in order here. If you can not see the bottom using 1.8 and table 1-2, it clearly would be a defect and rework would be the only option Well, my thoughts anyway, wonder if someone has other thoughts on thi
Electronics Forum | Sat Feb 18 15:40:45 EST 2006 | Cmiller
Switch to SN100C (no pun intended). I cant help with the SAC 305 issues but we should have a wave with SN100 running very soon. I will let you all know how that goes. Please report back on the x-sectioning and share the results. I have heard some v
Electronics Forum | Wed May 09 13:37:07 EDT 2007 | jmills
Greetings Tried to search past threads without an answer. I have a resistor that just fits the between pads. Some of the resisitor were installed without the termnation sitting on the pad and are infact sitting on solder a good .020 to .025 above th
Electronics Forum | Thu Oct 26 11:49:54 EDT 2006 | sms_don
CW, The good news is that you are not trying to use SAC paste with SnPb balls for that would be a void generator due to the ball being liquidous while the SAC paste is still in a flux cleaning stage. Two points to consider: One, voids are not an i
Electronics Forum | Thu Feb 10 11:40:25 EST 2005 | Carol
Hello All, Can somebody direct me to a facility or school or even a business that can offer an x-ray course for Class 3 electronic circuit board population interpretation, as in BGA ball acceptance, connector solderability fill acceptance etc.? Some
