Electronics Forum: ipc-7093 voids (Page 1 of 1)

IC Solder Voiding

Electronics Forum | Wed Dec 11 07:05:28 EST 2019 | ameenullakhan

Hi, Below may help you out. per IPC 7093 ( Design and assembly Process Implementation for Bottom Termination Components ),Clause 6.1.5.3 voids on thermal pad up to 50% does not result in loss of thermal performance. Since the void criteria is

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Sat Apr 28 08:04:29 EDT 2018 | shuhaib

Hi, please go through IPC 7093, its only for design and assembly process implementation for bottom termination components. its says up to 50% voids will not reduce ant electrical and thermal performance.

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh

Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi

Voiding in LGA (LT) soldering

Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009

You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat

QFN Side fillet

Electronics Forum | Thu Aug 01 05:25:26 EDT 2019 | ameenullakhan

Hi , hope below information may help you. The presence of small voids in thermal pad region is not likely to result in degradation of thermal and electrical performance The combing of smaller multiple voids up to 50% of the thermal pad area, does

Void under QFN TI LMZ20502SILT

Electronics Forum | Fri Jul 27 09:47:20 EDT 2018 | davef

Adding to Rob's suggestions ... One of the theories about voiding in thermal / ground pads of BTC is: Solder starts melting at the edge of the pad and moves inward towards the center of the solder mass. This traps flux volatilizes. So, there needs t

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