Electronics Forum | Tue Jan 18 12:53:50 EST 2000 | Russ
IPC 782 has package dimensions Russ
Electronics Forum | Mon Nov 29 18:54:30 EST 2004 | russ
IPC 782 has some info in it by package type. This is usually dictated by each component manufacturer. All SMT parts should be able to withstand 220 C for at least 60 sec. Russ
Electronics Forum | Tue Jun 07 14:31:56 EDT 2005 | russ
No max spacing spec. except that it should not be so far away from the other one that it is no longer on the board! IPC 782 shows .5mm spacing for the min.
Electronics Forum | Tue May 16 14:17:34 EDT 2006 | russ
If the terms are connected electrically it does meet IPC bridging between "non common conductors" is the defect you should be fine, FYI, the .010" spacing is a violation of IPC 782 Russ
Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach
| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme
Electronics Forum | Fri Jan 14 11:16:45 EST 2005 | Dan Gosselin
I have heard of people using a round pad or Home plate design to decrease the incidence of tombstoning on 0402's Anyone have any practical experience on this or is everyone just using the IPC 782 recommended land pattern (28mil x 33mil rectangle pad
Electronics Forum | Tue May 16 14:37:10 EDT 2006 | slthomas
Thanks for the replies, fellas. Pretty much what I'd thought too, but you know, when it just doesn' LOOK right.... "the .010" spacing is a violation of IPC 782" Not my problem. ;) You should see the decal they're using for the Xilinx PQFP 208. No
Electronics Forum | Wed Jan 12 13:19:20 EST 2000 | Wolfgang Busko
Hi Abbas, Dave gave you a lot of sources which cover I think almost all topics in this field. Like in a search function if you are interested in specific topics could you please specify what you are interested in so that ones knows what answer could
Electronics Forum | Tue Oct 17 01:42:34 EDT 2000 | Peter Carry
Dave, That's the funny thing, thru all that the output was pretty consistant with at least one bridge per board. * The ICs are going thru the wave in-line, according to IPC-782 figure 3-9, "Preferred IC Orientation". * Flatness of second wave is cont
Electronics Forum | Fri Mar 02 06:25:04 EST 2001 | PeteC
Thanks for your feedback. All the 0603 chips have the round solder lands but the 0805 chips and larger are rectangular. After speaking with the designer on it he said they chose round lands for the 0603 chips to get higher density of the circuit trac
winsouce.jpg)
.gif)
