Electronics Forum | Thu Apr 08 19:32:52 EDT 1999 | Tom Reilly
FYI, Yes, it is true SMT Plus [ http://www.smtplus.com/ ]does not meet IPC 782 standards but is that the goal here or to meet IPC-A-610 standards for manufacturing? I agree that patterns do cause some problems if created to maximum IPC standards but
Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
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