Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ
IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t
Electronics Forum | Wed Jul 12 08:57:58 EDT 2006 | Evamaria
Mike , Look at http://www.circuittechctr.com, Guidebook, section 6,6.1. This method of attaching jumper wires is in accordance to the acceptability criteria of IPC-A-610 section 11.2.4.3. You did not specify what wire AWG is. I am assuming it is sma
Electronics Forum | Tue Aug 29 23:18:32 EDT 2006 | mrduckmann2000
Help, I have a customer asking if our shop conforms to IPC-a-610 class 2 specs. He is asking if our Humidity is kept under 40% and if we have a particle count under 5MG......where can I find info in the IPC spec on humidty and particle count in the
Electronics Forum | Fri Apr 13 07:25:06 EDT 2007 | davef
Your paste should meet the mid-point of outside lead bend. If you cannot meet that, IPC-A-610D, 8.2.5.6 defines the minimum. We agree that it gets confusing when you post multiple threads on the same or very similar topic.
Electronics Forum | Mon Dec 29 07:23:57 EST 2008 | ghenning
Watch out for workmanship specs. I don't believe this is covered under IPC-A-610. You may have to write your own. Alignment of the fixture and coplanarity of the bar and substrate are key. Also, pay close attention to stencil aperture and thicknes
Electronics Forum | Wed Jul 06 09:27:49 EDT 2011 | rdouglass
Has anyone come across any good visuals for the solderability requirements for component leads with toe-down configuration? IPC-A-610 does not have any visual aids for this category and our inspectors are having a difficult time assessing based sole
Electronics Forum | Thu Mar 29 08:28:28 EDT 2012 | williamaxler
In the IPC-A-610E standard QFNs are classified as BTC (bottom termination components). Most QFNs do not have a solder-able surface on the outside of the part. Usually the lead that you can see on the outside is copper and classified is not solder-a
Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist
Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.
Electronics Forum | Thu Jul 07 01:26:34 EDT 2016 | lukvel
I have not tested whether there is electrostatic discharge on the PCB or not because the electrostatic meter is still on its way. But the IPC-A-610 section 3.1.2 specifies that yes even compressed air nozzles that move air over insulating surfaces g
Electronics Forum | Tue Jul 04 14:50:52 EDT 2017 | dleeper
Thanks! good stuff. I am disappointed the IPC has put off updating QFN solder filet specs till rev H. It's a pet peeve of mine trying to argue with customers that a visible toe filet on a QFN is not necessary, and may not even be possible depending
