Electronics Forum: ipc-a-610 (Page 13 of 23)

Conformal Coating

Electronics Forum | Tue Nov 01 09:16:03 EDT 2011 | austinpeterman

Hello, Looking for a solution to silicon conformal coating wicking up into connectors. We build IPC-A-610 class 2. We are using a PVA 650 with Dow Corning 1-2577 conformal coating. We have solder joints that must be coated 1.25mm from the connecto

Re: Workmanship Standards

Electronics Forum | Mon Apr 10 22:32:14 EDT 2000 | Dave F

Mark: If you're looking for a baseline document for judging the acceptability of: * Mechanical assembly * Component installation * Soldering * Cleanliness * Marking * Coating * Laminate condition * Discrete wiring * Surface mounting of components .

Touch-up and inspection of visual defects

Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge

I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve

Solder Balls

Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c

Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red

Re: PBGA Criteria

Electronics Forum | Thu Oct 26 18:10:11 EDT 2000 | ptvianc

Philip: Cases 1-3, those criteria may be specified in more recent versions of ANSI/J-STD-001 and/or ANSI/IPC-A-610. Unfortunately, I do not have any new versions of these specs. that may cover these points. As for voids in BGA joints, I have not

flow thru

Electronics Forum | Fri Oct 29 13:45:03 EDT 1999 | David Vulcano

We are placing several axial components that have STEEL leads. Have noticed that the steel components do not get good flow thru(we manufacture to IPC-A-610 Class II Standards which reqires 75% flow thru) We are using Seho Wave Machines with Nitroge

physical law of Dewetting

Electronics Forum | Thu Nov 01 04:31:47 EST 2001 | ianchan

I refer to IPC-A-610C, section 12.4.5, the defect term "dewetting". Can the experts pls help define the actual stages that constitute the formation of a dewetting defect? I do understand the common concept teachings that there may be contamination

Tilted/Slant SMT Component Specs?

Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan

Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted

Solder joints/inspection

Electronics Forum | Thu Jul 18 21:00:57 EDT 2002 | davef

Platitudes about soldering are: * People ARE NOT good at soldering. * Machines ARE good at soldering. You can purchase a good used wave soldering machine for $20k. * Training helps people to be better at soldering. * Your solder connections should

Standard of PCB Bow and Twist in Incoming Inspecion

Electronics Forum | Fri Feb 28 09:08:03 EST 2003 | davef

Without drilling through the numbers, they're probably correct. Recognize that standard warp / twist specs [IPC-A-610 1.5% for PTH only and 0.75% for SMT] are not going to make it on tech boards. You need to define specific requirements. This warp


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