Electronics Forum | Fri Jul 19 13:02:01 EDT 2019 | davef
Double-check me on this, but I don't believe that A-610 [IPC-A-610] requires side fillets on QFN solder connections, because the sides of most terminations are not plated. Plating on the bottom of the termination is sufficient for a proper solder con
Electronics Forum | Thu Aug 10 07:29:43 EDT 2017 | stivais
How do you evaluate the soldering quality for those QFNs? X-Ray or AOI? For some QFNs (and other bottom termination components) it's not supposed to have solder fillets on toes. It's also noted in IPC-A-610 (Rev.F 8.3.13). Take a look at your QFN ch
Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Electronics Forum | Tue Mar 26 10:30:28 EDT 2019 | pavel_murtishev
Hello, Could you please tell me if there is any industry standard specifying QFN to PCB standoff after soldering? Is any gap allowed? Browsing IPC-A-610, I have found nothing. Any input would be appreciated. Regards
Electronics Forum | Sun Feb 23 21:19:08 EST 2020 | sssamw
Yes, this is for tin-lead profile. And for the QFN pins which has copper exposed that not required and not possible to have fillet on side surface as in IPC, see 8.3.13, in IPC-A-610-G
Electronics Forum | Fri Jul 08 16:35:04 EDT 2005 | Jason Fullerton
"Whether or not you need a toe fillet depends on your application. We have high reliability products where we can't use a QFN over a certain size, regardless of toe fillet. We have other applications where we meet the thermal cycle requirements for a
Electronics Forum | Mon Jul 22 02:13:31 EDT 2019 | jandon
some PQFN package configurations have no toe exposed or do not have a continous solderable surface on the exposed toe and a toe fillet will not form. (IPC-A-610F 8.3.13)
Electronics Forum | Tue Jul 04 14:50:52 EDT 2017 | dleeper
Thanks! good stuff. I am disappointed the IPC has put off updating QFN solder filet specs till rev H. It's a pet peeve of mine trying to argue with customers that a visible toe filet on a QFN is not necessary, and may not even be possible depending
Electronics Forum | Thu Mar 29 08:28:28 EDT 2012 | williamaxler
In the IPC-A-610E standard QFNs are classified as BTC (bottom termination components). Most QFNs do not have a solder-able surface on the outside of the part. Usually the lead that you can see on the outside is copper and classified is not solder-a
Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev
Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61
