Electronics Forum | Fri Mar 05 08:51:06 EST 2010 | pjc
Just got this off the wire, new IPC A610E Document -due out in April: http://www.solder.net/marketplace/product_desc.asp?Sku=IPC-A-610E&Category=61
Electronics Forum | Fri Sep 23 12:24:57 EDT 2011 | minda
I found some useful information in a red line version of IPC-A-610E I uncovered with a quick google search, and I will see what I can find out about their standard of acceptability.
Electronics Forum | Fri Sep 23 10:34:41 EDT 2011 | blnorman
IPC-A-610E "Acceptability of Electronic Assemblies" addresses this specific issue as well as most others. This issue would be to what class (1, 2, or 3) your assemblies would be governed by.
Electronics Forum | Fri Sep 23 10:40:49 EDT 2011 | minda
I found IPC-A-610E, but I cannot find one online that I can view without purchasing. We do not want to pay for a standard we are not sure we will be able to use.
Electronics Forum | Mon Jul 24 07:18:51 EDT 2017 | jamesbarnhart
IPC has updated assembly standards for IPC A-610 and IPC JSTD-001 making them easier to use and adding information in areas that have evolved. Both IPC J-STD-001E and IPC-A-610E have also been more closely linked to eliminating the differences that c
Electronics Forum | Thu Mar 29 08:28:28 EDT 2012 | williamaxler
In the IPC-A-610E standard QFNs are classified as BTC (bottom termination components). Most QFNs do not have a solder-able surface on the outside of the part. Usually the lead that you can see on the outside is copper and classified is not solder-a
Electronics Forum | Thu Jan 31 10:20:04 EST 2013 | rjohnston58
Need your help with a referee call on solder balls. See attached pictures. Engineering believes the solder balls and splash in pictures violate IPC-A-610E-2010 section 5.2.7.1. Purchasing on the other hand believes these are acceptable. Info: balls a
Electronics Forum | Mon Oct 12 15:51:47 EDT 2015 | davef
IPC-A-610E-2010, Acceptability of Electronic Assemblies, 8.3.4 Castellated Terminations talks to the acceptability of solder connections on components like yours. It’s tough to say from the pictures, but I’d say your issues are: Missing solder: Plat
Electronics Forum | Wed May 27 13:50:38 EDT 2015 | ingallsd
I saw a question regarding the acceptability of stacking chip components at this forum posted in 2000. Unfortunately no one could cite any applicable IPC sections at that time. I am now able to find that this is acceptable per IPC-A-610D, Section 8.
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
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