Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Electronics Forum | Fri Oct 13 08:09:41 EDT 2017 | davef
While I wouldn't be happy with this "Hershey's Kiss" appearing solder connection, I'd suck it up and and accept it as acceptable according to IPC-A-610F, Section 5.1
Electronics Forum | Fri Nov 17 11:03:32 EST 2017 | davef
IPC-A-610F, 10.1, Non-Soldered Contact Areas: Has words to the effect that for Class 1, 2, 3; it is defect to have solder or any other contamination in the critical contact area.
Electronics Forum | Mon Jul 22 02:13:31 EDT 2019 | jandon
some PQFN package configurations have no toe exposed or do not have a continous solderable surface on the exposed toe and a toe fillet will not form. (IPC-A-610F 8.3.13)
Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef
James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem
Electronics Forum | Tue Jul 18 09:05:54 EDT 2017 | davef
Acceptability of Electronic Assemblies IPC-A-610 F Comparison E to F versions * http://www.electronicsyorkshire.org.uk/UserFiles/PDFs/610E%20to%20F%20Redline%20comparison.pdf * https://www.youtube.com/watch?v=kD5NpsocTpw * http://www.scanditron.c
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Tue Jul 19 18:05:31 EDT 2016 | davef
I'm not real clear on what you're looking to understand, but let me get things started ... IPC-A-610F - Acceptability of Electronic Assemblies, 7.3.3 Supported Holes – Wire/Lead Protrusion Minimum length: You need to be able to discern the compone
Electronics Forum | Thu Oct 12 13:15:37 EDT 2017 | davef
It is the two conditions pictured in IPC-A-610F, Figure 5-1 C, D. In the old, simplier days, we wanted our solder connection to have: * Low wetting angle * Shiny metal Today, the metal doesn't have to be shiny and the wetting angle can be a high
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