Electronics Forum | Tue Jun 18 09:00:39 EDT 2019 | edhare
Hi Matt. I recommend that you see also IPC-D-279, Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies, July 1996 or current revision.
Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F
Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des
Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Tue Jan 11 09:47:01 EST 2000 | Dave F
Abbas: Sources of information on DFM/DFT are: � "SMTnet Express" articles on DFM by Earl Moon � IPC-D-279, 'Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies' � Books in SMTnet and SMTA book stores � Other examples ar
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