Electronics Forum: ipc-tm-650; method 2.4.25 (Page 1 of 10)

Military Lamina bake-out

Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef

IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for

IPC-TM-650

Electronics Forum | Wed Jul 22 08:52:29 EDT 2009 | spitkis2

Can someone clarify whether IPC-TM-650 Test Method 2.6.27 (Thermal Stress, Convection Reflow Assembly Simultation) is required for all bare board fabricators? Or is this test method optional, depending on the type or class of boards being fabricated

West coast testing labs?

Electronics Forum | Thu Mar 22 17:33:38 EST 2001 | davef

Steve, IPC TM-650 Test Methods Manual is a load. IPC TM-650 Test Methods Manual: Section 2.1 Visual Test Methods Section 2.2 Dimensional Test Methods Section 2.3 Chemical Test Methods Section 2.4 Mechanical Test Methods Section 2.5 Electrical Test M

Ionic Contamination Tests

Electronics Forum | Tue Sep 25 17:42:11 EDT 2007 | gsala

your comments will be appreciated, please; IC tests have been performed on two kind of Raw PCBs (HASL) samples by adopting three different methods : First Sample (supllier A) - Omegameter 600 SMT, solvent=40�C: extratcing time 10 min result = 0.2

Is there a cross section standard test method...

Electronics Forum | Mon Mar 24 10:38:33 EDT 2008 | davef

No standard, but common practice is: IPC-TM-650 Test Methods Manual * Method 2.1.1, Microsectioning, Manual Method * Method 2.1.1.2, Microsectioning, Semi or Automatic Technique

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

Ionic Contamination Tests

Electronics Forum | Tue Sep 25 20:33:02 EDT 2007 | davef

We vote for: IPC-TM-650 2.3.25.1, solvent: 80�C, extract time: 60 minutes, hold time: 30 minutes or until room temperature. Listen, it really doesn't matter which method you decide to use. IPC-TM-650 2.3.25 is a process control method. It's more imp

warp and twist

Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef

Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and

Re: Underfilled CSP mechanical test

Electronics Forum | Mon Jun 19 09:54:21 EDT 2000 | Paul Houston

Go to www.ipc.org and click on search. search for: IPC Test Methods Manual Section 6 IPC TM-650 Test Methods Manual SECTION 2.6 - ENVIRONMENTAL TEST METHODS Paul

Cleanliness Testing Samples - What to Use?

Electronics Forum | Fri Oct 08 11:51:10 EDT 2004 | blnorman

Since you are using an Ionograph you need to use IPC-TM-650 method 2.3.25, static method. The test method is free on the IPC website. You'll need to get your customer to give you an acceptable cleanliness level to test to.

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