Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef
Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and
Electronics Forum | Fri Apr 20 13:55:09 EDT 2001 | kawiederhold
Hey Dougie, If you go to IPC.ORG and click on the on-line resources and databases, then on the "free downloads" link, the second or third document "for free" is the IPC-TM-650 in its entirety. It does discuss the test you are looking for! Have fun
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Thu Dec 26 12:12:55 EST 2013 | igorfo
Dear Friends, I need your help to understand requirements and measurement methods for bow and twist of assembled PCB (PCBA have and SMT and TH components). I already check all posts on the site but didn't found any related to my question answers.
Electronics Forum | Fri Apr 20 07:12:22 EDT 2001 | wbu
Dougie, oh yes, it�s a bit short that chapter. I have the Revision e in front of me and this one contains in the appendix the needed IPC-TM-650 Test method for bow and twist. Can�t think that they don�t have that in the new revision. Hope you find
Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens
Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,
Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds
Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.
Electronics Forum | Fri Apr 20 05:32:39 EDT 2001 | dougie
Hi, I've just splashed out �60 on IPC-A-600F trying to find out the formula for measuring the bow and twist of raw PCB's. Much to my dismay there are 10 lines on the subject in the whole standard. Worse still is that it tells me nothing I don't alre
Electronics Forum | Thu Feb 27 12:27:10 EST 2003 | stevel
Hi all, We got some bare pwb in our incoming inspecion looked really wrapped. The maximum twist of the pwb we messured is 0.056inch by following the method in IPC-TM-650 2.4.22 C. (The diagonal size of our pwb is 7.5inch) According to the IPC standa
Electronics Forum | Tue Nov 25 16:26:43 EST 2003 | tdurston
We are trying to establish requirements and process controls for completed, cleaned SMT assemblies. We have problems with our high impedance circuits (100 meg ohms) being affected by residue. Some boards require additional cleaning cycles to remove
