Electronics Forum | Fri Jul 16 11:27:57 EDT 2010 | davef
Consider: * Bow & Twist IPC-TM-650; Method 2.4.22 * Previous threads on SMTnet, like: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=54498
Electronics Forum | Thu Apr 07 20:16:23 EDT 2005 | davef
Q1) Simple way to measure the PCB warpage A1) IPC-TM-650; Method 2.4.22 Bow & Twist Q2) What is the maximum warpage can the SMT machine allow the to accept and place the component without problem. A2) That depends. IPC-A-610 Acceptability of Elect
Electronics Forum | Sun Apr 10 06:27:50 EDT 2005 | WarpSpeed
1.) First of all: What is Your customers requirements??? 2.) If the customer or You don't have a specification; I will strongly recommend that you follow the "IPC-IPC-TM-650 Method 2.4.22 Bow & Twist" that [DaveF] suggested. 3.) If You have "critic
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens
Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,
Electronics Forum | Thu Feb 27 12:27:10 EST 2003 | stevel
Hi all, We got some bare pwb in our incoming inspecion looked really wrapped. The maximum twist of the pwb we messured is 0.056inch by following the method in IPC-TM-650 2.4.22 C. (The diagonal size of our pwb is 7.5inch) According to the IPC standa
Electronics Forum | Mon Nov 20 19:49:03 EST 2006 | davef
Sorry for stating this incorrectly. It should been: Bow & twist for bare boards and panels: IPC-A-610 Acceptability of Electronic Assemblies, 10.6: 1.5% for PTH only and 0.75% for SMT, acording to test method TM-650, method 2.4.22 IPC-6012, par. 3.
Electronics Forum | Wed Jul 22 08:52:29 EDT 2009 | spitkis2
Can someone clarify whether IPC-TM-650 Test Method 2.6.27 (Thermal Stress, Convection Reflow Assembly Simultation) is required for all bare board fabricators? Or is this test method optional, depending on the type or class of boards being fabricated
Electronics Forum | Thu Mar 22 17:33:38 EST 2001 | davef
Steve, IPC TM-650 Test Methods Manual is a load. IPC TM-650 Test Methods Manual: Section 2.1 Visual Test Methods Section 2.2 Dimensional Test Methods Section 2.3 Chemical Test Methods Section 2.4 Mechanical Test Methods Section 2.5 Electrical Test M
Electronics Forum | Tue Sep 25 17:42:11 EDT 2007 | gsala
your comments will be appreciated, please; IC tests have been performed on two kind of Raw PCBs (HASL) samples by adopting three different methods : First Sample (supllier A) - Omegameter 600 SMT, solvent=40�C: extratcing time 10 min result = 0.2
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